Working Principle of the Thermal Cycling Test Machine
The thermal cycling test machine provides stable high- and low-temperature environments through its cooling and heating functions, meeting the complex and varied temperature demands of semiconductor manufacturing. Its basic operating principle is as follows:
Cooling and heating: the machine integrates both functions in a single unit. A compressor compresses and drives the refrigerant, which circulates between the evaporator and the condenser to deliver cooling and heating.
Temperature control: high-sensitivity temperature sensors and a refined control system enable accurate temperature regulation, keeping semiconductor devices in the correct temperature environment throughout manufacturing and improving product quality and stability.
Applications: in semiconductor processing the machine is used in critical steps such as film growth, thermal treatment, doping, and cleaning and etching. Precise temperature control optimises process conditions and improves product quality and performance.
Application Examples
In semiconductor processing, the machine provides the precise temperature environment required for film growth, promoting the chemical reactions that produce high-quality films. Accurate temperature control optimises growth conditions and improves film uniformity and density, raising overall device performance.
The machine also plays an important role in thermal treatment, doping, and cleaning and etching. In the oxidation process, for example, precise temperature control produces a dense silicon dioxide layer that effectively protects the wafer surface against chemical impurities and leakage current.